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Title of article :
Fully SMT-compatible optical-I/O package with microlens array interface
Author/Authors :
Y.، Ishii, نويسنده , , N.، Tanaka, نويسنده , , T.، Sakamoto, نويسنده , , H.، Takahara, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
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Abstract :
A new optoelectronic package for interchip optical interconnections is presented. To make cost-effective IC-packaging and printed circuit board (PCB) assembly, we strongly emphasize the need for full compatibility with surface-mount technology (SMT). Based on the "OptoBump" interface, which couples the package and PCB by means of an array of wide, collimated beams, we developed two prototype packages: a transmitter package that contains a vertical-cavity surface-emitting laser (VCSEL) array and a driver-IC, and a receiver package that contains a photodiode (PD) array and a receiver-IC. A microlens array is integrated with each package to counteract misalignments that occur in the SMT process. All three output signals, which are E/O (O/E)-converted in the each package, exhibit clear eye diagrams at 1.25 Gb/s after the packages are surfacemounted on a PCB. The influence of polymer encapsulation on a VCSEL and an evaluation of the optical interface provided by the three optical beams on a 500-(mu)m center-tocenter spacing are also discussed.
Keywords :
Metal ions , Salts , inhibition , activation
Journal title :
Journal of Lightwave Technology
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