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Title of article :
On plasma processing of polymers and the stability of the surface properties for enhanced adhesion to metals
Author/Authors :
Arefi-Khonsari، نويسنده , , F and Kurdi، نويسنده , , J and Tatoulian، نويسنده , , M and Amouroux، نويسنده , , J، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2001
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Abstract :
This paper deals with the plasma surface treatment of polymers in a low frequency bell jar reactor with non-symmetrical configuration of electrodes. The highly energetic character of this discharge due to its low excitation frequency and electrode configuration, as well as its small discharge volume makes it a very efficient and fast functionalization process. Amongst the different plasma gases used for the adhesion improvement of polypropylene to aluminum, ammonia has shown to be the most suitable one for this application. Since the NH and NH2 radicals play an important role in the kinetics of nitrogen incorporation in polymers, mixtures of N2 and H2 were also used as possible substitutes for ammonia. The former are more environmentally friendly and easier to handle in industry than ammonia. The efficiency of nitrogen rich mixtures in the case of the second application, i.e. adhesion improvement of copper to fluoropolymers has been compared to that of ammonia which still shows faster nitrogen incorporation. The last part of this paper is devoted to the study of the energetic character of plasmas of mixtures of He+NH3 by OES and electrical measurements in the whole range of composition of the two gases. The results show that an ammonia percentage ranging from 5 to 10% in plasmas of mixtures of He/NH3 represents a transition between two different discharge regimes. Plasmas of mixtures of He+2% NH3, characterized by highly energetic electrons, ions and probably metastables of helium give rise to enhanced adhesion of PP to aluminum which remains stable with time.
Keywords :
Adhesion , Helium , aging , Fluropolymers , Polypropylene , PLASMA , Ammonia , OES
Journal title :
Surface and Coatings Technology
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