Record number :
1144250
Title of article :
Analysis of the growth of individual grains during recrystallization in pure nickel Original Research Article
Author/Authors :
Y.B. Zhang، نويسنده , , A. Godfrey، نويسنده , , Q. Liu، نويسنده , , W. Liu، نويسنده , , D. Juul Jensen، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2009
Pages :
9
From page :
2631
To page :
2639
Abstract :
The growth of individual grains during recrystallization in 96% cold-rolled pure nickel has been followed using electron backscatter pattern maps of the same surface area taken after each of several annealing steps. It was found that the growth is quite complex, with boundaries moving, stopping and moving again. The growth kinetics differ from grain to grain and, on average, cube-oriented grains grow the fastest. The growth of the grains has also been analyzed as a function of boundary misorientation. This analysis shows that there is no significant difference in misorientation distribution between boundaries that move and those that do not. This is contrary to the usual assumption that the boundary mobility and the migration rate depend on the misorientation across a boundary. This observation and the reasons for the faster growth of cube-oriented grains are discussed.
Keywords :
Growth kinetics , Recrystallization , Electron backscattering patterns (EBSP) , nickel
Journal title :
ACTA Materialia
Serial Year :
2009
Link To Document :
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