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Title of article :
Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
Author/Authors :
Sukhoon Jeong، نويسنده , , Hyunseop Lee، نويسنده , , Hanchul Cho، نويسنده , , Sangjik Lee، نويسنده , , Hyoungjae Kim، نويسنده , , Sungryul Kim، نويسنده , , Jaehong Park، نويسنده , , Haedo Jeong، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Pages :
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Abstract :
High roughness and a greater number of defects were created by lithium niobate (LN; LiNbO3) processes such as traditional grinding and mechanical polishing (MP), should be decreased for manufacturing LN device. Therefore, an alternative process for gaining defect-free and smooth surface is needed. Chemical mechanical planarization (CMP) is suitable method in the LN process because it uses a combination approach consisting of chemical and mechanical effects. First of all, we investigated the LN CMP process using commercial slurry by changing various process conditions such as down pressure and relative velocity. However, the LN CMP process time using commercial slurry was long to gain a smooth surface because of lower material removal rate (MRR). So, to improve the material removal rate (MRR), the effects of additives such as oxidizer (hydrogen peroxide; H2O2) and complexing agent (citric acid; C6H8O7) in a potassium hydroxide (KOH) based slurry, were investigated. The manufactured slurry consisting of H2O2–citric acid in the KOH based slurry shows that the MRR of the H2O2 at 2 wt% and the citric acid at 0.06 M was higher than the MRR for other conditions.
Keywords :
Citric acid (C6H8O7) , Hydrogen peroxide (H2O2) , LiNbO3) , MRR (material removal rate) , Chemical mechanical planarization (CMP) , Lithium niobate (LN
Journal title :
Applied Surface Science
Link To Document :